Halnziye

Series: HY510 - Package type: Syringe - Content: 1g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.2 ° C-in²/W - Specific Gravity: > 2.0 g/cm³ Viscosity: 1000 - Thixotropic Index: 380±10 1/10 mm Moment Bore Temperature: -50 +280°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%

[Thermal Conductivity](ca://s?q=Explain_thermal_conductivity) > 1.93 B/M·K [Component Compatibility](ca://s?q=PC_component_compatibility) Suitable for CPU, VGA, LED, chipset, and other PC components [Compliance](ca://s?q=RoHS_compliance_explanation) RoHS compliant and meets semiconductor industry standards [Thermal Resistance](ca://s?q=What_is_thermal_resistance) < 0.225 °C·in²/W [Reliability](ca://s?q=High_stability_materials) High stability and long‑term reliability